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Enfabrica 3.2 Tbps ACF SuperNIC Chip: Boosting AI Data Center Performance And Reliability For Massive AI Cluster Scale

19 novembre 2024 à 21:55
At Supercomputing 2024 (SC24), Enfabrica Corporation unveiled a milestone in AI data center networking: the Accelerated Compute Fabric (ACF) SuperNIC chip. This 3.2 Terabit-per-second (Tbps) Network Interface Card (NIC) SoC redefines large-scale AI and machine learning (ML) operations by enabling massive scalability, supporting clusters of over 500,000 GPUs. Enfabrica also raised $115 million in funding and is expected to release its (ACF) SuperNIC chip in Q1 2025.Addressing AI Networking ChallengesAs […]

Imagimob and Infineon: Accelerating Autonomous and Electric Vehicle Edge AI Solutions On AURIX Microcontrollers

10 octobre 2024 à 21:09
Autonomous driving and electrification are key innovation drivers in the automotive industry. They rely on efficient Edge AI solutions to support essential functions like driver behavior monitoring, pedestrian recognition, traffic sign identification, and trajectory control. Today, Imagimob, a subsidiary of Infineon Technologies AG, has strengthened its automotive machine learning portfolio by integrating AI capabilities into Infineon’s ASIL-D (Automotive Safety Integrity Level D) compliant automotive MCUs, such as the AURIX™ TC3x […]

Infineon Introduces World’s First 300 mm GaN Power Technology

16 septembre 2024 à 06:57
Infineon Technologies has developed the world’s first 300 mm gallium nitride (GaN) wafer technology, marking a significant milestone in the power semiconductor industry. By leveraging its existing 300 mm silicon manufacturing infrastructure, Infineon has created a scalable, high-volume production process that enhances cost-efficiency.The 300 mm GaN wafers offer 2.3 times more chips per wafer compared to 200 mm wafers, improving production efficiency and device performance. This innovation positions Infineon as […]
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