MediaTek introduced two new SoCs today, the Dimensity 7300 and Dimensity 7300X. The successors of the Dimensity 7050, they are built on a 4nm process. MediaTek claims the chips prioritize power efficiency and performance to enable smooth multitasking, superior photography, accelerated gaming, and AI-driven computing. The Dimensity 7300X specifically targets flip-style foldable devices, thanks to its support for dual displays.Both chipsets feature an octa-core CPU configuration comprising 4 Arm Cortex-A78 […]