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Enfabrica 3.2 Tbps ACF SuperNIC Chip: Boosting AI Data Center Performance And Reliability For Massive AI Cluster Scale

19 novembre 2024 à 21:55
At Supercomputing 2024 (SC24), Enfabrica Corporation unveiled a milestone in AI data center networking: the Accelerated Compute Fabric (ACF) SuperNIC chip. This 3.2 Terabit-per-second (Tbps) Network Interface Card (NIC) SoC redefines large-scale AI and machine learning (ML) operations by enabling massive scalability, supporting clusters of over 500,000 GPUs. Enfabrica also raised $115 million in funding and is expected to release its (ACF) SuperNIC chip in Q1 2025.Addressing AI Networking ChallengesAs […]

MediaTek Unveiled The Dimensity 9400 Its Flagship Mobile SoC Featuring Second-Gen “All-Big-Core” CPU Architecture And An Agentic AI-ready NPU

10 octobre 2024 à 15:36
MediaTek has launched its newest flagship mobile System-on-Chip (SoC), the Dimensity 9400, marking a significant leap in mobile computing power. Built on TSMC’s 2nd-generation 3 nm process, this chipset promises substantial improvements in both performance and energy efficiency. Compared to its predecessor, the Dimensity 9300, this new processor is up to 40% more power-efficient. 2nd-Generation “All-Big-Core” CPU DesignAt the heart of the Dimensity 9400 is MediaTek’s second-generation “All-Big-Core” architecture, featuring the […]
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